Strain Measurement Devices
SMD Sensors builds precision measurement products across three fundamental sensing technologies — Thin Film, Capacitive, and Ultrasonic. Each technology is matched to the demands of the application, from sub-micron force sensing to non-invasive bubble detection.
Technology Overview
THIN FILMPrecision at the microscale
Thin film technology involves depositing ultra-thin layers of conductive or resistive material onto a substrate to create highly accurate sensing elements. This manufacturing process enables exceptional repeatability, low hysteresis, and superior temperature stability — ideal for demanding measurement environments.
Key Benefits
Thin Film Product Families
All products
High-accuracy thin film pressure sensors for gauge, absolute, and differential measurement across a wide range of media and pressure ranges.

Precision thin film load cells and force sensors designed for integration into OEM equipment, offering high resolution and reliability.

Custom and standard thin film-based scale platforms for precise weight measurement in medical, laboratory, and industrial applications.

High-performance rotary torque measurement solutions built on thin film technology for dynamic and static torque sensing requirements.
Technology Comparison
Use this reference to understand the key differences across SMD's three core sensing platforms.
| Criterion | Thin Film | Ultrasonic | Capacitive |
|---|---|---|---|
| Contact with Fluid | Direct | None (clamp-on) | None (through wall) |
| Primary Measurement | Pressure, Force, Weight, Torque | Flow, Bubbles, Level | Level (continuous & point) |
| Media Compatibility | Wide range of media | Any liquid or slurry | Non-conductive preferred |
| Temperature Range | Very wide (−40°C to +150°C+) | Standard to extended | Wide |
| Ideal Applications | OEM embedded sensing | Medical fluid management | Tank & vessel level monitoring |
Our application engineers work directly with your team to match the best sensing technology to your measurement requirements, environment, and integration constraints.